中 文 版
English
Home
About Us
Research
People
Facilities
Training
User Guide
Contact Us
Facilities
●
Micro/nano Fabrication
> He/Ne-ion Microscope
> DTL UV Litography
> DWL 66+
> EBL Raith 150
> EBL JBX-6300FS
> FIB/SEM DB235
> FIB/SEM Helios 600i
> UV Mask Aligner MA6
> 3D DLW
> Nano Imprint
> Laser Interference Lithography
●
Dry Etching
> RIE Plasma80
> RIE NGP80
> Ion Beam Etching
> ICP Plasma100
> ICP Cobra
> Microwave Plasma
●
Materials Growth
> TED DZ-300
> EBD FU-12PEB
> Thermal Evaporator
> Atomic Layer Deposition
> Electron Beam Evaporator
> UHV Thin Film Deposition
> MPCVD
> PECVD
●
Charactorization
> SNOM
> Nano Indenter
> AFM
> Dual Probe SEM
> AFM/MFM
> PPMS
> Surface Profiler
> Ellipsometer
> Electro-chemical Stat.
> 3D Surface Analyzer
> Probe Stage
●
Auxiliary
> Wire Bonder
> Rapid Annealing Process
Thermal Evaporator System (DZ-300)
Technical specifications and key features:
Vacuum: < 6.67×10-5 Torr
Temperature during deposition: <80℃
Sample size: < 4” and small pieces of samples
Uniformity: <5%
Number of crucibles: 3
Control: Touch panel
Installed with live thickness monitoring
Contact person：
Baogang Quan
Techniques and Applications:
For various types of materials depositions during devices and structures fabrication.
