DWL 66+ Maskless Lithography System
Technical specifications and key features:
- Wafer size：up to 230mm (diameter)
- Pattern area：up to 8 inches
- Write model: 0.6,1.0 , 2.0, 4.0μm
- 0.6μm laser write speed: 6mm2/min
- 1μm laser write speed：39mm2/min
- 2μm laser write speed：145mm2/min
- 4μm laser write speed：500mm2/min
- Laser wavelength：405nm
- Laser energy：300mW
- Alignment accuracy: 500nm
- Grayscale: 256
- Auto focus accuracy：100nm
Contact person：Haifang Yang
