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Facilities
●
Micro/nano Fabrication
> He/Ne-ion Microscope
> DTL UV Litography
> DWL 66+
> EBL Raith 150
> EBL JBX-6300FS
> FIB/SEM DB235
> FIB/SEM Helios 600i
> UV Mask Aligner MA6
> 3D DLW
> Nano Imprint
> Laser Interference Lithography
●
Dry Etching
> RIE Plasma80
> RIE NGP80
> Ion Beam Etching
> ICP Plasma100
> ICP Cobra
> Microwave Plasma
●
Materials Growth
> TED DZ-300
> EBD FU-12PEB
> Thermal Evaporator
> Atomic Layer Deposition
> Electron Beam Evaporator
> UHV Thin Film Deposition
> MPCVD
> PECVD
●
Charactorization
> SNOM
> Nano Indenter
> AFM
> Dual Probe SEM
> AFM/MFM
> PPMS
> Surface Profiler
> Ellipsometer
> Electro-chemical Stat.
> 3D Surface Analyzer
> Probe Stage
●
Auxiliary
> Wire Bonder
> Rapid Annealing Process
Micro/nano Fabrication
He/Ne-ion Microscope
DTL UV Litography
DWL 66+
EBL Raith 150
EBL JBX-6300FS
FIB/SEM DB235
FIB/SEM Helios 600i
UV Mask Aligner MA6
3D DLW
Nano Imprint
Laser Interference Lithography
Dry Etching
RIE Plasma80
RIE NGP80
Ion Beam Etching
ICP Plasma100
ICP Cobra
Microwave Plasma
Materials Growth
TED DZ-300
EBD FU-12PEB
Thermal Evaporator
Atomic Layer Deposition
Electron Beam Evaporator
UHV Thin Film Deposition
MPCVD
PECVD
Charactorization
SNOM
Nano Indenter
AFM
Dual Probe SEM
AFM/MFM
PPMS
Surface Profiler
Ellipsometer
Electro-chemical Stat.
3D Surface Analyzer
Probe Stage
Auxiliary
Wire Bonder
Rapid Annealing Process
