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Micro/nano Fabrication
> He/Ne-ion Microscope
> DTL UV Litography
> DWL 66+
> EBL Raith 150
> EBL JBX-6300FS
> FIB/SEM DB235
> FIB/SEM Helios 600i
> UV Mask Aligner MA6
> 3D DLW
> Nano Imprint
> Laser Interference Lithography
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Dry Etching
> RIE Plasma80
> RIE NGP80
> Ion Beam Etching
> ICP Plasma100
> ICP Cobra
> Microwave Plasma
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Materials Growth
> TED DZ-300
> EBD FU-12PEB
> Thermal Evaporator
> Atomic Layer Deposition
> Electron Beam Evaporator
> UHV Thin Film Deposition
> MPCVD
> PECVD
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Charactorization
> SNOM
> Nano Indenter
> AFM
> Dual Probe SEM
> AFM/MFM
> PPMS
> Surface Profiler
> Ellipsometer
> Electro-chemical Stat.
> 3D Surface Analyzer
> Probe Stage
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Auxiliary
> Wire Bonder
> Rapid Annealing Process
High Vacuum E-Beam Evaporator System(FU-12PEB)
Technical specifications and key features:
Deposited materials: High melting point metals and high purity insulators
Vacuum: < 3×10-7 Torr
Temperature during deposition: <90℃
Sample size: < 6” and small pieces of samples
Uniformity: <3%
Number of crucibles: 6
Installed with live thickness monitoring and automatic control system
Contact person：
Baogang Quan
Techniques and Applications:
For various types of materials depositions during devices and structures fabrication.
