UK Oxford Instrument Plasmalab80Plus Reactive Ion Etching System
Technical specifications and key features:
Reactive gas source: O2, Ar, CF4,CHF3,SF6
Max. RF power:600W
Electrode size:240mm
Processing materials: Oxides, semiconductors, metals
Sample size: up to 6 inches
Contact person:Xiaoxiang Xia

Techniques and Applications:
For various types of materials removal based on reactive ion etching to form micro-/nano structures on substrates, towards the construction of photonic, biological, mechanical, electrical and medical devices to examine the size and quantum effects, etc.